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OLED panel suppliers for iPhone 16 line are having issues due to thinner bezel design


In line with The Elec (through AppleInsider), Apple is asking its iPhone 16 panel suppliers to make the underside bezel of the iPhone 16 fashions utilizing BRS. However that is giving Apple’s panel suppliers a headache. Making the underside bezel thinner would require the suppliers to work tougher to cover some circuitry below the bezel. Whereas the highest and facet iPhone bezels could possibly be made thinner with no issues, shrinking the underside bezel has been tough due to points with warmth dissipation.

Due to this warmth era, the wiring on the underside a part of the panels should be bent downward and different adjustments should be made; with these adjustments, not one of the panel suppliers have been in a position to manufacture the shows with a yield that’s acceptable to Apple.

The report provides that LG Show is popping to 2 sources to acquire the essential Show Driver IC (DDI) chips that it wants for the shows it’s making for the iPhone 16 line. The chip controls the show pixels by a skinny movie transistor (TFT). Prior to now, LG Show counted on LX Semicon for the DDI chips it wanted, however will allegedly flip to Novatech to obtain the part later this 12 months.

LG Show’s transfer is designed to chop prices because it creates competitors between the 2 suppliers which ought to scale back pricing. LG Show is gaining extra enterprise from Apple and is anticipating to obtain 20% extra income from its iPhone enterprise year-over-year. Final 12 months LG Show delivered 52.5 million OLED shows to Apple for the iPhone. 

Samsung Show ought to stay the highest show provider for the handset even with the anticipated improve in LG Show’s orders. Final 12 months Samsung Show delivered near 150 million OLED panels for the iPhone. The third panel provider employed by Apple for the iPhone, China’s BOE, sources DDI chips from LX Semicon whereas Samsung Show stays in-house getting its chips from Samsung Electronics System LSI.



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