The variety of transistors inside a chip provides you an thought of how highly effective and/or energy-efficient stated chip is. An instance I like to make use of includes Apple’s A-series software processor (AP) used to energy the iPhone. The A13 Bionic AP that powered the iPhone 11 collection was constructed by TSMC utilizing its 7nm course of node and got here loaded with 8.5 billion transistors. Final 12 months’s 3nm A17 Professional AP, used to energy the iPhone 15 Professional and iPhone 15 Professional Max, carries 19 billion transistors.Â
We already know that MediaTek’s subsequent flagship AP, the Dimensity 9400, goes to be a powerhouse with a configuration that options one Cortex-X5 Prime CPU core, 4 Cortex-X4 Prime CPU cores, and 4 Cortex-A720 efficiency CPU cores. As soon as once more, there aren’t any low-power effectivity cores. Two separate “X” subscribers,
@faridofanani96 and
@negativeonehero have despatched tweets (through
Wccftech) giving us some information concerning the Dimensity 9400 SoC.
Based on @faridofanani96, the Dimensity 9400 AP will measure 150mm² making it the biggest chipset earmarked for a smartphone when it’s launched later this 12 months. It will enable the SoC to hold a lot of transistors together with an even bigger Neural Processing Unit (NPU) for AI and Machine Studying. Cache sizes may even be bigger and the Dimensity 9400 AP might be outfitted with greater than 30 billion transistors.
MediaTek’s Dimensity 9300 AP powers the Vivo X100 collection
The tweet from @negativeonehero exhibits a picture from the Vulkan GPUInfo database supposedly displaying that the Dimensity 9400 SoC will characteristic the Mali-TKRX MC12 GPU. One rumor requires a 20% efficiency hike in graphics over the Dimensity 9300 SoC which might be sufficient for MediaTek’s new flagship smartphone chip to prime the graphics efficiency of the upcoming Snapdragon 8 Gen 4 chipset.
This screenshot from the Vulkan GPUInfo database reportedly exhibits the GPU that the Dimensity 9400 SoC will characteristic
TSMC might be manufacturing the Dimensity 9400 AP utilizing its second-generation 3nm node (N3E) and all issues thought of, it will most likely be the most costly smartphone chipset ever designed by MediaTek.
Identical to final 12 months when there have been rumors concerning the Dimensity 9300 overheating, there was some speak concerning the Cortex-X5 Prime CPU core having some temperature points. One idea is that MediaTek elevated the dimensions of the chip’s die as a option to cope with this challenge.
