What you have to know
- A brand new datasheet leak reveals the specs of the upcoming Snapdragon 8 Gen 4 SoC.
- The flagship chipset will seemingly sport two variants with SM8750 and SM8750P mannequin numbers.
- The latter is anticipated to be performance-oriented in comparison with the common one.
Qualcomm might be gearing up for its subsequent flagship SoC by its Snapdragon Summit in a few months. Right here, we anticipate to see the Snapdragon 8 Gen 4, which is already confirmed to sport an all-new Oryon CPU.
After seeing a number of benchmark leaks, a brand new datasheet (through SmartPrix) has leaked, revealing among the essential specs of the upcoming chipset. The attention-grabbing one within the lot is maybe the 2 mannequin numbers of the identical chip bearing SM8750 and SM8750P. This implies we would see two variants of Qualcomm’s flagship SoC.
The “P” within the latter is presumably for the efficiency side of the chipset, which ought to seemingly be a tad bit higher than the usual mannequin, which can energy a lot of the highly effective Android telephones ranging from This autumn 2024.
Apart from the mannequin numbers, the newest information sheet confirms that the Snapdragon 8 Gen 4 is constructed on a 3nm course of aiming for superior efficiency and energy effectivity. It might probably be achieved by the Oryon CPU, which was confirmed earlier by Qualcomm’s chief advertising and marketing officer, Don McGuire, at MWC early this 12 months.
The upcoming flagship chipset would incorporate the Adreno 8-series GPU, which guarantees the very best graphic efficiency and energy effectivity. The brand new 8-series ISP can even enhance photograph and video experiences. The information sheet additionally confirms the existence of mmWave and Sub-6 bands since it is a 5G-powered SoC, in spite of everything.
Different key parts of the upcoming Snapdragon 8 Gen 4 embody Low-Energy AI (LPAI) subsystem paired with dedication DSP and AI accelerator (eNPU) coupled with Qualcomm Sensing Hub (QSH), which ought to seemingly deliver enhancements to AI. The chipset additional helps FastConnect 7900 modem subsequent to Wi-FI 7 and Bluetooth 5.4. Customers can anticipate LPDDR5X RAM and UWB help as effectively.
Whereas these specs of the upcoming Snapdragon 8 Gen 4 look promising, it’s only a matter of a few months earlier than we see the chipset in motion. Qualcomm has already announced the dates of this 12 months’s Snapdragon Summit, which is occurring on Oct 21-24 in Hawaii. It is going to be attention-grabbing to see what the chipset maker brings to the desk with its subsequent flagship SoC. Additionally, Xiaomi will seemingly be the primary OEM to include the flagship chipset on Android smartphones by the top of this 12 months.